Questo sito web utilizza i cookie. Utilizzando questo sito, acconsenti all'utilizzo dei cookie. Per ulteriori informazioni, dai un'occhiata al nostro politica sulla riservatezza.

Le immagini servono solo come riferimento,

Vedi Specifiche Tecniche

PC28F640P33BF60A +BOM

64Mbit parallel NOR flash memory

Produttore:

Alliance Memory, Inc.
ProduttorePart #:

PC28F640P33BF60A
Scheda dati:

PC28F640P33BF60A Scheda dati (PDF)
Part Life Cycle Code:

Active
Reach Compliance Code:

compliant
Access Time-Max:

60 ns
Boot Block:

BOTTOM
EDA/CAD Modelli:

Richiedi modelli CAD gratuiti per PC28F640P33BF60A

PC28F640P33BF60A Descrizione generale

Intel's PC28F640P33BF60A stands out for its versatility in supporting both synchronous and asynchronous read operations, accommodating various system architectures with ease. Additionally, the chip comes equipped with built-in error correction codes (ECC), fortifying data integrity and ensuring accurate information storage. Whether used in industrial machinery, automotive systems, or telecommunications devices, this flash memory chip delivers exceptional performance and durability, making it a preferred choice for demanding applications

Caratteristiche principali

High performance
— 85/88 ns initial access
— 40 MHz with zero wait states, 20 ns clock-to data output synchronous-burst read mode
— 25 ns asynchronous-page read mode
— 4-, 8-, 16-, and continuous-word burst mode
— Buffered Enhanced Factory Programming (BEFP) at 5 µs/byte (Typ)
— 1.8 V buffered programming at 7 µs/byte (Typ)
Architecture
— Multi-Level Cell Technology: Highest Density at Lowest Cost
— Asymmetrically-blocked architecture
— Four 32-KByte parameter blocks: top or bottom configuration
— 128-KByte main blocks
Voltage and Power
—VCC(core) voltage: 1.7 V – 2.0 V
—VCCQ (I/O) voltage: 1.7 V – 3.6 V
— Standby current: 55 µA (Typ) for 256-Mbit
— 4-Word synchronous read current: 13 mA (Typ) at 40 MHz
Quality and Reliability
— Operating temperature: –40 °C to +85 °C
1-Gbit in SCSP is –30 °C to +85 °C
— Minimum 100,000 erase cycles per block
— ETOX™ VIII process technology (130 nm)
Security
— One-Time Programmable Registers:
64 unique factory device identifier bits
64 user-programmable OTP bits
Additional 2048 user-programmable OTP bits
— Selectable OTP Space in Main Array:
4x32KB parameter blocks + 3x128KB main blocks (top or bottom configuration)
— Absolute write protection: VPP= VSS
— Power-transition erase/program lockout
— Individual zero-latency block locking
— Individual block lock-down
Software
— 20 µs (Typ) program suspend
— 20 µs (Typ) erase suspend
—Intel® Flash Data Integrator optimized
— Basic Command Set and Extended Command Set compatible
— Common Flash Interface capable
Density and Packaging
— 64/128/256-Mbit densities in 56-Lead TSOP package
— 64/128/256/512-Mbit densities in 64-Ball Intel®Easy BGA package
— 64/128/256/512-Mbit and 1-Gbit densities in Intel®QUAD+ SCSP
— 16-bit wide data bus

Specifiche

Part Life Cycle Code	Active	Reach Compliance Code	compliant
Access Time-Max	60 ns	Boot Block	BOTTOM
Clock Frequency-Max (fCLK)	52 MHz	Command User Interface	YES
Common Flash Interface	Y	Data Polling	NO
Endurance	100000 Write/Erase Cycles	JESD-30 Code	R-PBGA-B64
Length	10 mm	Memory Density	67108864 bit
Memory IC Type	FLASH	Memory Width	16
Number of Functions	1	Number of Sectors/Size	4,63
Number of Terminals	64	Number of Words	4194304 words
Number of Words Code	4000000	Operating Mode	SYNCHRONOUS
Operating Temperature-Max	85 °C	Operating Temperature-Min	-40 °C
Organization	4MX16	Output Characteristics	3-STATE
Page Size	8 words	Parallel/Serial	PARALLEL
Programming Voltage	3 V	Ready/Busy	YES
Seated Height-Max	1.2 mm	Sector Size	16K,64K
Standby Current-Max	0.002 A	Supply Current-Max	0.028 mA
Supply Voltage-Max (Vsup)	3.6 V	Supply Voltage-Min (Vsup)	2.3 V
Supply Voltage-Nom (Vsup)	3 V	Surface Mount	YES
Technology	CMOS	Terminal Form	BALL
Terminal Pitch	1 mm	Terminal Position	BOTTOM
Type	NOR TYPE	Width	8 mm

Politiche di servizio e altro

Relativi al servizio post-vendita e alla liquidazione

Pagamento

Metodo di pagamento

TT/bonifico bancario

PayPal

Western Union

Grammo dei soldi

Per canali di pagamento alternativi, contattaci a:

[email protected]

Spedizione e imballaggio

metodo di spedizione

Fedex

UPS

DHL

NTN

Imballaggio

AVAQ determina e confeziona tutti i dispositivi in base ai requisiti di protezione contro le scariche elettrostatiche (ESD) e il livello di sensibilità all'umidità (MSL)..