Metodo di pagamento
NAND256W3A2BN6E +BOM
With its high-speed performance and compact design
TSOP-48-
Produttore:
Micron Technology Inc.
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ProduttorePart #:
NAND256W3A2BN6E
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Scheda dati:
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Pbfree Code:
Yes
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Part Life Cycle Code:
Transferred
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Pin Count:
48
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ECCN Code:
EAR99
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EDA/CAD Modelli:
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NAND256W3A2BN6E Descrizione generale
The NAND256W3A2BN6E is a cutting-edge NAND flash memory chip designed for applications that demand high storage capacity and fast data access speeds. With a generous capacity of 256 gigabits (Gb), this chip is essential for modern electronics such as smartphones, tablets, and SSDs. The unique naming convention of "W3A2" hints at its specialized features or performance enhancements within the NAND flash memory lineup. Furthermore, the "BN6E" code likely signifies specific packaging or manufacturing attributes that ensure its reliability and compatibility with various devices
Caratteristiche principali
- HIGH DENSITY NAND FLASH MEMORIES
- – Up to 1 Gbit memory array
- – Up to 32 Mbit spare area
- – Cost effective solutions for mass storage applications
- NAND INTERFACE
- – x8 or x16 bus width
- – Multiplexed Address/ Data
- – Pinout compatibility for all densities
- SUPPLY VOLTAGE
- – 1.8V device: VDD = 1.7 to 1.95V
- – 3.0V device: VDD = 2.7 to 3.6V
- PAGE SIZE
- – x8 device: (512 + 16 spare) Bytes
- – x16 device: (256 + 8 spare) Words
- BLOCK SIZE
- – x8 device: (16K + 512 spare) Bytes
- – x16 device: (8K + 256 spare) Words
- PAGE READ / PROGRAM
- – Random access: 12µs (max)
- – Sequential access: 50ns (min)
- – Page program time: 200µs (typ)
- COPY BACK PROGRAM MODE
- – Fast page copy without external buffering
- FAST BLOCK ERASE
- – Block erase time: 2ms (Typ)
- STATUS REGISTER
- ELECTRONIC SIGNATURE
- CHIP ENABLE ‘DON’T CARE’ OPTION
- – Simple interface with microcontroller
- SERIAL NUMBER OPTION
- HARDWARE DATA PROTECTION
- – Program/Erase locked during Power transitions
- DATA INTEGRITY
- – 100,000 Program/Erase cycles
- – 10 years Data Retention
- RoHS COMPLIANCE
- – Lead-Free Components are Compliant with the RoHS Directive
- DEVELOPMENT TOOLS
- – Error Correction Code software and hardware models
- – Bad Blocks Management and Wear Leveling algorithms
- – File System OS Native reference software
- – Hardware simulation models
Specifiche
Pbfree Code | Yes | Part Life Cycle Code | Transferred |
Pin Count | 48 | Reach Compliance Code | |
ECCN Code | EAR99 | HTS Code | 8542.32.00.51 |
Access Time-Max | 12000 ns | Command User Interface | YES |
Data Polling | NO | JESD-30 Code | R-PDSO-G48 |
JESD-609 Code | e4 | Length | 18.4 mm |
Memory Density | 268435456 bit | Memory IC Type | FLASH |
Memory Width | 8 | Number of Functions | 1 |
Number of Sectors/Size | 2K | Number of Terminals | 48 |
Number of Words | 33554432 words | Number of Words Code | 32000000 |
Operating Mode | ASYNCHRONOUS | Operating Temperature-Max | 85 °C |
Operating Temperature-Min | -40 °C | Organization | 32MX8 |
Page Size | 512 words | Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Cel) | 245 | Programming Voltage | 3 V |
Qualification Status | Not Qualified | Ready/Busy | YES |
Seated Height-Max | 1.2 mm | Sector Size | 16K |
Standby Current-Max | 0.00005 A | Supply Current-Max | 0.02 mA |
Supply Voltage-Max (Vsup) | 3.6 V | Supply Voltage-Min (Vsup) | 2.7 V |
Supply Voltage-Nom (Vsup) | 3 V | Surface Mount | YES |
Technology | CMOS | Temperature Grade | INDUSTRIAL |
Terminal Finish | NICKEL PALLADIUM GOLD | Terminal Form | GULL WING |
Terminal Pitch | 0.5 mm | Terminal Position | DUAL |
Time@Peak Reflow Temperature-Max (s) | 30 | Toggle Bit | NO |
Type | SLC NAND TYPE | Width | 12 mm |
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