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Vedi Specifiche Tecniche

W25Q64FVBYIQ +BOM

Flash, 8MX8, PBGA16, WLCSP-16

Produttore:

WINBOND ELECTRONICS CORP
ProduttorePart #:

W25Q64FVBYIQ
Scheda dati:

W25Q64FVBYIQ Scheda dati (PDF)
Part Life Cycle Code:

Not Recommended
Reach Compliance Code:

compliant
ECCN Code:

EAR99
HTS Code:

8542.32.00.51
EDA/CAD Modelli:

Richiedi modelli CAD gratuiti per W25Q64FVBYIQ

E-mail: [email protected]

Skype: live:.cid.ab6b29428937b76

tel: +852 95804164

W25Q64FVBYIQ Descrizione generale

FEATURES Family of SpiFlash Memories– W25Q64FV: 64M-bit / 8M-byte (8,388,608)– Standard SPI: CLK, /CS, DI, DO, /WP, /Hold– Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3– QPI: CLK, /CS, IO0, IO1, IO2, IO3 Highest Performance Serial Flash– 104MHz Standard/Dual/Quad SPI clocks– 208/416MHz equivalent Dual/Quad SPI– 50MB/S continuous data transfer rate– More than 100,000 erase/program cycles– More than 20-year data retention Efficient “Continuous Read” and QPI Mode– Continuous Read with 8/16/32/64-Byte Wrap– As few as 8 clocks to address memory– Quad Peripheral Interface (QPI) reducesinstruction overhead– Allows true XIP (execute in place) operation– Outperforms X16 Parallel Flash Low Power, Wide Temperature Range– Single 2.7 to 3.6V supply– 4mA active current, <1μA Power-down (typ.)– -40°C to +85°C operating range Flexible Architecture with 4KB sectors– Uniform Sector Erase (4K-bytes)– Uniform Block Erase (32K and 64K-bytes)– Program 1 to 256 byte per programmable page– Erase/Program Suspend & Resume Advanced Security Features– Software and Hardware Write-Protect– Top/Bottom, 4KB complement array protection– Power Supply Lock-Down and OTP protection– 64-Bit Unique ID for each device– Discoverable Parameters (SFDP) Register– 3X256-Bytes Security Registers with OTP locks– Volatile & Non-volatile Status Register Bits Space Efficient Packaging– 8-pin SOIC/VSOP 208-mil– 8-pad WSON 6x5-mm/8x6-mm– 8-pad XSON 4x4-mm– 16-pin SOIC 300-mil– 8-pin PDIP 300-mil– 24-ball TFBGA 8x6-mm– 16-ball WLCSP– Contact Winbond for KGD and other options

Specifiche

Part Life Cycle Code	Not Recommended	Reach Compliance Code	compliant
ECCN Code	EAR99	HTS Code	8542.32.00.51
Alternate Memory Width	1	Clock Frequency-Max (fCLK)	104 MHz
Data Retention Time-Min	20	JESD-30 Code	R-PBGA-B16
Length	3.405 mm	Memory Density	67108864 bit
Memory IC Type	FLASH	Memory Width	8
Number of Functions	1	Number of Terminals	16
Number of Words	8388608 words	Number of Words Code	8000000
Operating Mode	SYNCHRONOUS	Operating Temperature-Max	85 °C
Operating Temperature-Min	-40 °C	Organization	8MX8
Output Characteristics	3-STATE	Parallel/Serial	SERIAL
Seated Height-Max	0.512 mm	Serial Bus Type	SPI
Standby Current-Max	0.00005 A	Supply Voltage-Max (Vsup)	3.6 V
Supply Voltage-Min (Vsup)	3 V	Surface Mount	YES
Technology	CMOS	Temperature Grade	INDUSTRIAL
Terminal Form	GULL WING	Terminal Pitch	0.8 mm
Terminal Position	BOTTOM	Width	2.335 mm
Write Protection	HARDWARE/SOFTWARE

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