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DS3660B+ +BOM

DeepCover Security Manager for Low-Voltage Operation with 1KB Secure Memory and Programmable Tamper Hierarchy

Produttore:

Maxim Integrated
ProduttorePart #:

DS3660B+
Scheda dati:

DS3660B+ Scheda dati (PDF)
PackingQty:

Tray,416
PackingOption:

Tray
TempRange:

-40 to 85C
EDA/CAD Modelli:

Richiedi modelli CAD gratuiti per DS3660B+

DS3660B+ Descrizione generale

DeepCover^? embedded security solutions cloak sensitive data under multiple layers of advanced physical security to provide the most secure key storage possible.One of the DS3660's primary features is the on-chip nonimprinting memory, consisting of eight 128-byte banks incorporating a high-speed, direct-wired clearing function. The 1KB memory is constantly complemented in the background to prevent memory imprinting of data. The DS3660 architecture allows the user to clear selective banks of the memory based upon specified tamper events. In the event of a qualified tamper event, the desired bank(s) of memory are rapidly cleared and a negative bias can be applied to erase external memory.The DS3660 includes a seconds counter, watchdog timer, CPU supervisor, nonvolatile (NV) SRAM controller, and on-chip temperature sensor. In the event of a primary power failure, an external battery source is automatically switched in to keep the memory, time, and tamper-detection circuitry active. Optionally, an internal 1.8V bias source can be selected to keep a low-voltage SRAM alive. The DS3660 is configurable to operate with a low-voltage mobile host microprocessor interface for embedded battery-operated devices. The DS3660 provides low-leakage tamper-detection inputs for interface to external sensors, interlocks, and antitamper meshes. The DS3660 also invokes a tamper event on absolute temperature, if the temperature rate-of-change (ROC) exceeds programmed limits, or if the crystal oscillator frequency falls outside a specified window. The tamper event is latched and timestamped for fault-recovery purposes.Access to the timer, tamper monitoring, nonimprinting memory, and device configuration is conducted through an I2C-compatible interface. The DS3660 is assembled in a Pb-free, 7mm x 7mm x 0.8mm CSBGA package.

Caratteristiche principali

Memory
- 1024-Byte Nonimprinting Memory with High-Speed Erase
- 64 Bytes General-Purpose RAM (Not Cleared)
- External SRAM Control and Optional Tamper-Event Erasure
- Segmented Tamper-Detection Memory Hierarchy with Programmable Tamper-Event Sources
Tamper
- On-Chip Programmable Temperature Sensing with Proprietary ROC Detector
- Two General-Purpose Tamper-Detect Logic Inputs
- Four Uncommitted Tamper-Detect Comparator Inputs
- Four Window Comparators with On-Chip Reference Voltage
- Latching and Timestamping of Tamper Events
- Crystal Oscillator Tamper Monitoring
Other
- Low-Voltage Host Microprocessor Interface
- Programmable Power-Consumption Options for Very Low Standby Current
- 64-Bit Unique Silicon Serial Number
- On-Chip Random-Number Generator (RNG)
- 32-Bit Seconds Counter with Watchdog Timer and Alarm Output
- CPU Supervisor
- I²C-Compatible Interface

Applicazione

Access-Control Security Systems
ATMs
Cryptographic Processors
E-Commerce Servers
Gaming Systems
Network Routers and Switches
Network Storage Servers
PIN Pads
Point-of-Sale Terminals
Secure Communications
Set-Top Boxes
Smart Card Readers
Software-Defined Radios

Specifiche

model	DS3660B+	packingQty	Tray,416
packingOption	Tray	lifeCycle	production
tempRange	-40 to 85C

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