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XC5VSX50T-1FFG1136I +BOM

FPGA XC5VSX50T-1FFG1136I

Produttore:

XILINX
ProduttorePart #:

XC5VSX50T-1FFG1136I
Scheda dati:

XC5VSX50T-1FFG1136I Scheda dati (PDF)
Pbfree Code:

Yes
Part Life Cycle Code:

Transferred
Pin Count:

1136
Reach Compliance Code:

compliant

XC5VSX50T-1FFG1136I Descrizione generale

The XC5VSX50T-1FFG1136I is a cutting-edge Virtex-5 FPGA developed by Xilinx, tailored for demanding high-performance applications. With 50,000 logic cells, this FPGA is capable of handling complex designs that require extensive logic processing. Built on a 65nm process technology, it strikes a perfect balance between performance and power consumption. Equipped with internal memory blocks, configurable input/output blocks, and DSP blocks, it offers efficient data storage, external device interfacing, and signal processing capabilities. The inclusion of advanced features such as on-chip power management and built-in Ethernet MAC further enhances its functionality. Housed in a 1136-pin Fine-Pitch Ball Grid Array (FFG) package, it is well-suited for high-density applications that demand a large number of connections. Its design allows for easy integration into electronic systems by mounting it on a printed circuit board

Specifiche

Pbfree Code	Yes	Part Life Cycle Code	Transferred
Pin Count	1136	Reach Compliance Code	compliant
ECCN Code	3A991.D	HTS Code	8542.39.00.01
Factory Lead Time	72 Weeks	Combinatorial Delay of a CLB-Max	0.9 ns
JESD-30 Code	S-PBGA-B1136	JESD-609 Code	e1
Length	35 mm	Moisture Sensitivity Level	4
Number of CLBs	4080	Number of Inputs	480
Number of Logic Cells	52224	Number of Outputs	480
Number of Terminals	1136	Operating Temperature-Max	100 °C
Operating Temperature-Min	-40 °C	Organization	4080 CLBS
Peak Reflow Temperature (Cel)	245	Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY
Qualification Status	Not Qualified	Seated Height-Max	3.25 mm
Supply Voltage-Max	1.05 V	Supply Voltage-Min	0.95 V
Supply Voltage-Nom	1 V	Surface Mount	YES
Technology	CMOS	Temperature Grade	INDUSTRIAL
Terminal Finish	TIN SILVER COPPER	Terminal Form	BALL
Terminal Pitch	1 mm	Terminal Position	BOTTOM
Time@Peak Reflow Temperature-Max (s)	30	Width	35 mm

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