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XC5VLX330T-1FFG1738I is a programmable logic device with a BGA package size of 42.5x42.5 and a capacity of 331776 logic cells and 25920 flip-flops
FCBGA-1738Produttore:
ProduttorePart #:
XC5VLX330T-1FFG1738I
Scheda dati:
Pbfree Code:
Yes
Part Life Cycle Code:
Transferred
Pin Count:
1738
Reach Compliance Code:
not_compliant
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Xilinx's XC5VLX330T-1FFG1738I FPGA, a part of the Virtex-5 family, offers a robust solution with its 330,000 logic cells, catering to complex logic implementations. With a maximum of 732 user I/Os, it provides extensive connectivity options, while its 1,248 Kb of block RAM and 608 Kb of distributed RAM offer ample storage for data processing tasks. Operating at a maximum speed of 550 MHz, this FPGA delivers fast and efficient processing capabilities and supports various interfaces such as DDR, PCIe, and Gigabit Ethernet, catering to diverse system requirements. In addition, its integrated power management features enhance energy efficiency and thermal management, making it a sustainable choice. Housed in a 1738-pin flip-chip package, the XC5VLX330T-1FFG1738I ensures high reliability and durability, even in demanding environments
Pbfree Code | Yes | Part Life Cycle Code | Transferred |
Pin Count | 1738 | Reach Compliance Code | not_compliant |
ECCN Code | 3A001.A.7.A | HTS Code | 8542.39.00.01 |
Combinatorial Delay of a CLB-Max | 0.9 ns | JESD-30 Code | S-PBGA-B1738 |
JESD-609 Code | e1 | Length | 42.5 mm |
Moisture Sensitivity Level | 4 | Number of CLBs | 25920 |
Number of Inputs | 960 | Number of Logic Cells | 331776 |
Number of Outputs | 960 | Number of Terminals | 1738 |
Operating Temperature-Max | 100 °C | Operating Temperature-Min | -40 °C |
Organization | 25920 CLBS | Peak Reflow Temperature (Cel) | 245 |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | Qualification Status | Not Qualified |
Seated Height-Max | 3.25 mm | Supply Voltage-Max | 1.05 V |
Supply Voltage-Min | 0.95 V | Supply Voltage-Nom | 1 V |
Surface Mount | YES | Temperature Grade | INDUSTRIAL |
Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | Terminal Form | BALL |
Terminal Pitch | 1 mm | Terminal Position | BOTTOM |
Time@Peak Reflow Temperature-Max (s) | 30 | Width | 42.5 mm |
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