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XC3S1600E-4FGG484I +BOM

Field Programmable Gate Array, 3688 CLBs, 1600000 Gates, 657MHz, 33192-Cell, CMOS, PBGA400

Produttore:

XILINX
ProduttorePart #:

XC3S1600E-4FGG484I
Scheda dati:

XC3S1600E-4FGG484I Scheda dati (PDF)
Pbfree Code:

Yes
Part Life Cycle Code:

Transferred
Pin Count:

484
Reach Compliance Code:

compliant
EDA/CAD Modelli:

Richiedi modelli CAD gratuiti per XC3S1600E-4FGG484I

E-mail: [email protected]

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XC3S1600E-4FGG484I Descrizione generale

The XC3S1600E-4FGG484I, a remarkable product manufactured by Xilinx, is a field programmable gate array (FPGA) that sets new standards in performance and versatility. With 1.6 million system gates and 1600 logic cells, it offers unparalleled computational power and flexibility for complex digital functions. The FPGA's 84 I/O pins, with a maximum of 356 user I/Os, provide extensive connectivity, while its 8 BlockRAM modules offer 112 Kb of temporary data storage. Operating at a maximum clock frequency of 550 MHz, the XC3S1600E-4FGG484I ensures rapid and efficient data processing, supporting standard interfaces such as SPI, I2C, UART, and JTAG for seamless communication with other system components

Specifiche

Pbfree Code	Yes	Part Life Cycle Code	Transferred
Pin Count	484	Reach Compliance Code	compliant
ECCN Code	3A991.D	HTS Code	8542.39.00.01
Factory Lead Time	52 Weeks	Clock Frequency-Max	572 MHz
Combinatorial Delay of a CLB-Max	0.76 ns	JESD-30 Code	S-PBGA-B484
JESD-609 Code	e1	Length	23 mm
Moisture Sensitivity Level	3	Number of CLBs	3688
Number of Equivalent Gates	1600000	Number of Inputs	376
Number of Logic Cells	33192	Number of Outputs	294
Number of Terminals	484	Operating Temperature-Max	100 °C
Operating Temperature-Min	-40 °C	Organization	3688 CLBS, 1600000 GATES
Peak Reflow Temperature (Cel)	250	Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY
Qualification Status	Not Qualified	Seated Height-Max	2.6 mm
Supply Voltage-Max	1.26 V	Supply Voltage-Min	1.14 V
Supply Voltage-Nom	1.2 V	Surface Mount	YES
Technology	CMOS	Temperature Grade	INDUSTRIAL
Terminal Finish	TIN SILVER COPPER	Terminal Form	BALL
Terminal Pitch	1 mm	Terminal Position	BOTTOM
Time@Peak Reflow Temperature-Max (s)	30	Width	23 mm

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