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XC2V1000-4FGG456C +BOM

456-Pin FBGA Package

Produttore:

XILINX
ProduttorePart #:

XC2V1000-4FGG456C
Scheda dati:

XC2V1000-4FGG456C Scheda dati (PDF)
Pbfree Code:

Yes
Part Life Cycle Code:

Obsolete
Pin Count:

456
ECCN Code:

3A991.D
EDA/CAD Modelli:

Richiedi modelli CAD gratuiti per XC2V1000-4FGG456C

E-mail: [email protected]

Skype: live:.cid.ab6b29428937b76

tel: +852 95804164

XC2V1000-4FGG456C Descrizione generale

Xilinx's XC2V1000-4FGG456C FPGA represents a leap forward in field-programmable gate array technology, offering an incredible 1 million system gates for unparalleled flexibility and customization. Operating at a nominal core voltage of 4.4 volts, this FPGA is engineered for reliable performance in typical operating environments, thanks to its commercial temperature grade. The 456-pin Fine-Pitch Ball Grid Array (FBGA) package type with a 1.0 mm ball pitch ensures seamless integration into various electronic systems. With advanced features and a high gate count, the XC2V1000-4FGG456C is perfectly suited for applications in telecommunications, automotive, aerospace, and industrial automation, providing designers with the necessary resources to efficiently implement complex digital designs

Specifiche

Pbfree Code	Yes	Part Life Cycle Code	Obsolete
Pin Count	456	Reach Compliance Code
ECCN Code	3A991.D	HTS Code	8542.39.00.01
Clock Frequency-Max	650 MHz	Combinatorial Delay of a CLB-Max	0.44 ns
JESD-30 Code	S-PBGA-B456	JESD-609 Code	e1
Length	23 mm	Moisture Sensitivity Level	3
Number of CLBs	1280	Number of Equivalent Gates	1000000
Number of Inputs	324	Number of Logic Cells	11520
Number of Outputs	324	Number of Terminals	456
Operating Temperature-Max	85 °C	Operating Temperature-Min
Organization	1280 CLBS, 1000000 GATES	Peak Reflow Temperature (Cel)	250
Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY	Qualification Status	Not Qualified
Seated Height-Max	2.6 mm	Supply Voltage-Max	1.575 V
Supply Voltage-Min	1.425 V	Supply Voltage-Nom	1.5 V
Surface Mount	YES	Technology	CMOS
Temperature Grade	OTHER	Terminal Finish	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form	BALL	Terminal Pitch	1 mm
Terminal Position	BOTTOM	Time@Peak Reflow Temperature-Max (s)	30
Width	23 mm

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