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XC2S600E-6FGG456C PBGA456
456-FBGA (23x23)Produttore:
ProduttorePart #:
XC2S600E-6FGG456C
Scheda dati:
Pbfree Code:
Yes
Part Life Cycle Code:
Obsolete
Pin Count:
456
Reach Compliance Code:
compliant
EDA/CAD Modelli:
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The XC2S600E-6FGG456C FPGA from Xilinx is a high-performance solution designed for complex applications. With 600,000 system gates, it offers extensive logic resources, making it suitable for demanding designs. The "6" speed grade indicates its impressive operating frequency capabilities, ensuring efficient performance. The 456-pin Fine-Pitch Ball Grid Array (FBGA) package type allows for a densely packed PCB design, making it ideal for space-constrained applications. Moreover, its advanced features such as on-chip RAM blocks, configurable logic blocks (CLBs), and I/O blocks provide versatile customization options to meet specific application requirements. Additionally, its support for various I/O standards including LVCMOS, LVTTL, HSTL, SSTL, and LVDS enables seamless interfacing with a wide range of peripherals and communication protocols, enhancing its compatibility and flexibility for different use cases
Pbfree Code | Yes | Part Life Cycle Code | Obsolete |
Pin Count | 456 | Reach Compliance Code | compliant |
ECCN Code | 3A991.D | HTS Code | 8542.39.00.01 |
Additional Feature | MAXIMUM USABLE GATES = 600000 | Clock Frequency-Max | 357 MHz |
Combinatorial Delay of a CLB-Max | 0.47 ns | JESD-30 Code | S-PBGA-B456 |
JESD-609 Code | e1 | Length | 23 mm |
Moisture Sensitivity Level | 3 | Number of CLBs | 3456 |
Number of Equivalent Gates | 210000 | Number of Inputs | 514 |
Number of Logic Cells | 15552 | Number of Outputs | 514 |
Number of Terminals | 456 | Operating Temperature-Max | 85 °C |
Operating Temperature-Min | Organization | 3456 CLBS, 210000 GATES | |
Peak Reflow Temperature (Cel) | 250 | Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
Qualification Status | Not Qualified | Seated Height-Max | 2.6 mm |
Supply Voltage-Max | 1.89 V | Supply Voltage-Min | 1.71 V |
Supply Voltage-Nom | 1.8 V | Surface Mount | YES |
Technology | CMOS | Temperature Grade | OTHER |
Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | Terminal Form | BALL |
Terminal Pitch | 1 mm | Terminal Position | BOTTOM |
Time@Peak Reflow Temperature-Max (s) | 30 | Width | 23 mm |
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