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XC2S300E-6FTG256C +BOM

Programmable logic device

Produttore:

XILINX
ProduttorePart #:

XC2S300E-6FTG256C
Scheda dati:

XC2S300E-6FTG256C Scheda dati (PDF)
Pbfree Code:

Yes
Part Life Cycle Code:

Obsolete
Pin Count:

256
ECCN Code:

EAR99
EDA/CAD Modelli:

Richiedi modelli CAD gratuiti per XC2S300E-6FTG256C

E-mail: [email protected]

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XC2S300E-6FTG256C Descrizione generale

Xilinx's XC2S300E-6FTG256C, part of the Spartan-II family, is an FPGA designed to provide high-speed performance and flexibility for a variety of digital system implementations. With a capacity of 300,000 system gates and a speed grade of -6, it offers programmable logic cells, configurable I/Os, embedded RAM, and built-in features for system integration. The FTG256C package with 256 pins ensures reliable connectivity and integration, making it suitable for applications such as industrial control, automotive electronics, telecommunications, and consumer electronics. Fabricated using advanced semiconductor manufacturing processes, this FPGA promises high performance and reliability. It is widely available for purchase from Xilinx and authorized distributors, providing designers with a versatile and reliable platform for implementing complex digital systems

Specifiche

Pbfree Code	Yes	Part Life Cycle Code	Obsolete
Pin Count	256	Reach Compliance Code
ECCN Code	EAR99	HTS Code	8542.39.00.01
Additional Feature	MAXIMUM USABLE GATES = 300000	Clock Frequency-Max	357 MHz
Combinatorial Delay of a CLB-Max	0.47 ns	JESD-30 Code	S-PBGA-B256
JESD-609 Code	e1	Length	17 mm
Moisture Sensitivity Level	3	Number of CLBs	1536
Number of Equivalent Gates	93000	Number of Inputs	329
Number of Logic Cells	6912	Number of Outputs	329
Number of Terminals	256	Operating Temperature-Max	85 °C
Operating Temperature-Min		Organization	1536 CLBS, 93000 GATES
Peak Reflow Temperature (Cel)	260	Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY
Qualification Status	Not Qualified	Seated Height-Max	2 mm
Supply Voltage-Max	1.89 V	Supply Voltage-Min	1.71 V
Supply Voltage-Nom	1.8 V	Surface Mount	YES
Technology	CMOS	Temperature Grade	OTHER
Terminal Finish	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Terminal Form	BALL
Terminal Pitch	1 mm	Terminal Position	BOTTOM
Time@Peak Reflow Temperature-Max (s)	30	Width	17 mm

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