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W25Q64DWSSIG +BOM

The W25Q64DWSSIG product is a PDSO8 packaged component measuring 0.208 inches and featuring a sleek green plastic design

Produttore:

Winbond Electronics
ProduttorePart #:

W25Q64DWSSIG
Scheda dati:

W25Q64DWSSIG Scheda dati (PDF)
Part Life Cycle Code:

Not Recommended
Pin Count:

8
Reach Compliance Code:

compliant
ECCN Code:

3A991.B.1.A
EDA/CAD Modelli:

Richiedi modelli CAD gratuiti per W25Q64DWSSIG

E-mail: [email protected]

Skype: live:.cid.ab6b29428937b76

tel: +852 95804164

W25Q64DWSSIG Descrizione generale

Not only does the W25Q64DWSSIG prioritize performance, but it also places a strong emphasis on reliability and data security. Equipped with both hardware and software protection mechanisms, this flash memory chip ensures that your valuable data is safe and secure at all times. Furthermore, its deep power-down mode minimizes power consumption when the chip is not in active use, promoting energy efficiency

Caratteristiche principali

Family of SpiFlash Memories
– W25Q64DW: 64M-bit / 8M-byte (8,388,608)
– Standard SPI: CLK, /CS, DI, DO, /WP, /Hold
– Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold
– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3
– QPI: CLK, /CS, IO0, IO1, IO2, IO3
Highest Performance Serial Flash
– 104MHz Standard/Dual/Quad SPI clocks
– 208/416MHz equivalent Dual/Quad SPI
– 50MB/S continuous data transfer rate
– More than 100,000 erase/program cycles
– More than 20-year data retention
Efficient “Continuous Read” and QPI Mode
– Continuous Read with 8/16/32/64-Byte Wrap
– As few as 8 clocks to address memory
– Quad Peripheral Interface (QPI) reduces instruction overhead
– Allows true XIP (execute in place) operation
– Outperforms X16 Parallel Flash
Low Power, Wide Temperature Range
– Single 1.7 to 1.95V supply
– 4mA active current, <1µA Power-down (typ.)
– -40°C to +85°C operating range
Flexible Architecture with 4KB sectors
– Uniform Sector Erase (4K-bytes)
– Uniform Block Erase (32K and 64K-bytes)
– Program 1 to 256 byte per programmable page
– Erase/Program Suspend & Resume
Advanced Security Features
– Software and Hardware Write-Protect
– Top/Bottom, 4KB complement array protection
– Power Supply Lock-Down and OTP protection
– 64-Bit Unique ID for each device
– 4X256-Bytes Security Registers with OTP locks
– Volatile & Non-volatile Status Register Bits
Space Efficient Packaging
– 8-pin SOIC 208-mil
– 8-pad WSON 6x5-mm/8x6-mm
– 16-pin SOIC 300-mil
– Contact Winbond for KGD and other options

Specifiche

Part Life Cycle Code	Not Recommended	Pin Count	8
Reach Compliance Code	compliant	ECCN Code	3A991.B.1.A
HTS Code	8542.32.00.51	Access Time-Max	7.5 ns
Additional Feature	TOP/BOTTOM BOOT BLOCK	Clock Frequency-Max (fCLK)	104 MHz
Data Retention Time-Min	20	Endurance	100000 Write/Erase Cycles
JESD-30 Code	R-PDSO-G8	Length	5.28 mm
Memory Density	8388608 bit	Memory IC Type	FLASH
Memory Width	32	Number of Functions	1
Number of Terminals	8	Number of Words	262144 words
Number of Words Code	256000	Operating Mode	SYNCHRONOUS
Operating Temperature-Max	85 °C	Operating Temperature-Min	-40 °C
Organization	256KX32	Parallel/Serial	SERIAL
Programming Voltage	1.8 V	Qualification Status	Not Qualified
Seated Height-Max	2.16 mm	Serial Bus Type	SPI
Standby Current-Max	0.00002 A	Supply Current-Max	0.04 mA
Supply Voltage-Max (Vsup)	1.95 V	Supply Voltage-Min (Vsup)	1.7 V
Supply Voltage-Nom (Vsup)	1.8 V	Surface Mount	YES
Technology	CMOS	Temperature Grade	INDUSTRIAL
Terminal Form	GULL WING	Terminal Pitch	1.27 mm
Terminal Position	DUAL	Type	NOR TYPE
Width	5.23 mm	Write Protection	HARDWARE/SOFTWARE

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Imballaggio

AVAQ determina e confeziona tutti i dispositivi in base ai requisiti di protezione contro le scariche elettrostatiche (ESD) e il livello di sensibilità all'umidità (MSL)..