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W25Q128FVEIG +BOM
Flash memory with 128MX1 capacity and WSON-8 form factor
8-WSON (8x6)-
Produttore:
Winbond Electronics
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ProduttorePart #:
W25Q128FVEIG
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Scheda dati:
-
Part Life Cycle Code:
Obsolete
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Pin Count:
8
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Reach Compliance Code:
compliant
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ECCN Code:
EAR99
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EDA/CAD Modelli:
Disponibilità: 7809 PZ
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W25Q128FVEIG Descrizione generale
The W25Q128FVEIG is a cutting-edge Serial NOR Flash memory chip designed for high performance and reliability. With a sizable capacity of 128 megabits and a voltage range of 2.7V to 3.6V, this chip is capable of meeting the demanding data storage needs of various industries. Its support for both SPI and QSPI interface protocols ensures efficient and fast data transfers, making it a suitable choice for automotive, networking, industrial, and consumer electronics applications
Caratteristiche principali
- New Family of SpiFlash Memories
- – W25Q128FV: 128M-bit / 16M-byte
- – Standard SPI: CLK, /CS, DI, DO, /WP, /Hold
- – Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold
- – Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3
- – QPI: CLK, /CS, IO0, IO1, IO2, IO3
- – Software & Hardware Reset
- Highest Performance Serial Flash
- – 104MHz Single, Dual/Quad SPI clocks
- – 208/416MHz equivalent Dual/Quad SPI
- – 50MB/S continuous data transfer rate
- – More than 100,000 erase/program cycles
- – More than 20-year data retention
- Efficient “Continuous Read” and QPI Mode
- – Continuous Read with 8/16/32/64-Byte Wrap
- – As few as 8 clocks to address memory
- – Quad Peripheral Interface (QPI) reduces instruction overhead
- – Allows true XIP (execute in place) operation
- – Outperforms X16 Parallel Flash
- Low Power, Wide Temperature Range
- – Single 2.7 to 3.6V supply
- – 4mA active current, <1µA Power-down (typ.)
- – -40°C to +85°C operating range
- Flexible Architecture with 4KB sectors
- – Uniform Sector/Block Erase (4K/32K/64K-Byte)
- – Program 1 to 256 byte per programmable page
- – Erase/Program Suspend & Resume
- Advanced Security Features
- – Software and Hardware Write-Protect
- – Power Supply Lock-Down and OTP protection
- – Top/Bottom, Complement array protection
- – Individual Block/Sector array protection
- – 64-Bit Unique ID for each device
- – Discoverable Parameters (SFDP) Register
- – 3X256-Bytes Security Registers with OTP locks
- – Volatile & Non-volatile Status Register Bits
- Space Efficient Packaging
- – 8-pin SOIC / VSOP 208-mil
- – 8-pin PDIP 300-mil
- – 8-pad WSON 6x5-mm / 8x6-mm
- – 16-pin SOIC 300-mil (additional /RESET pin)
- – 24-ball TFBGA 8x6-mm
- – Contact Winbond for KGD and other options
Specifiche
Part Life Cycle Code | Obsolete | Pin Count | 8 |
Reach Compliance Code | compliant | ECCN Code | EAR99 |
HTS Code | 8542.32.00.51 | Clock Frequency-Max (fCLK) | 104 MHz |
Data Retention Time-Min | 20 | Endurance | 100000 Write/Erase Cycles |
JESD-30 Code | R-PDSO-N8 | Length | 8 mm |
Memory Density | 134217728 bit | Memory IC Type | FLASH |
Memory Width | 1 | Number of Functions | 1 |
Number of Terminals | 8 | Number of Words | 134217728 words |
Number of Words Code | 128000000 | Operating Mode | SYNCHRONOUS |
Operating Temperature-Max | 85 °C | Operating Temperature-Min | -40 °C |
Organization | 128MX1 | Parallel/Serial | SERIAL |
Programming Voltage | 3 V | Qualification Status | Not Qualified |
Seated Height-Max | 0.8 mm | Serial Bus Type | SPI |
Standby Current-Max | 0.00002 A | Supply Current-Max | 0.02 mA |
Supply Voltage-Max (Vsup) | 3.6 V | Supply Voltage-Min (Vsup) | 2.7 V |
Supply Voltage-Nom (Vsup) | 3 V | Surface Mount | YES |
Technology | CMOS | Temperature Grade | INDUSTRIAL |
Terminal Form | NO LEAD | Terminal Pitch | 1.27 mm |
Terminal Position | DUAL | Type | NOR TYPE |
Width | 6 mm | Write Protection | HARDWARE/SOFTWARE |
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Prodotto 365 giorni
Qualità garantita
Promettiamo di fornire un servizio di garanzia della qualità di 365 giorni per tutti i nostri prodotti.
In Stock: 7.809
Minimum Order: 1
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