Metodo di pagamento
W25M02GVZEIG +BOM
WSON-8 packaged Flash memory with 1GX2 capacity
WSON-8-
Produttore:
Winbond Electronics
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ProduttorePart #:
W25M02GVZEIG
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Scheda dati:
-
Part Life Cycle Code:
Obsolete
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Reach Compliance Code:
compliant
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ECCN Code:
EAR99
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HTS Code:
8542.32.00.51
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EDA/CAD Modelli:
Disponibilità: 5370 PZ
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W25M02GVZEIG Descrizione generale
The W25M02GVZEIG from Winbond is a cutting-edge 2-gigabyte flash memory chip that is revolutionizing the world of electronic devices. With its high-speed data transfer rates and low power consumption, this chip is the perfect choice for portable gadgets such as smartphones, tablets, and digital cameras. Its serial interface makes it suitable for embedded applications, providing seamless communication with the host system. The support for the industry-standard SPI protocol ensures easy integration into existing systems, making it a versatile option for a wide range of electronic devices. Additionally, the advanced security features including hardware-based data protection and encryption guarantee the safety of stored information, a critical factor in today's digital age
Caratteristiche principali
- New Family of SpiFlash Memories
- – W25M02GV: 2x1G-bit / 2x128M-byte
- – Standard SPI: CLK, /CS, DI, DO, /WP, /Hold
- – Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold
- – Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3
- – Compatible SPI serial flash commands
- Highest Performance Serial NAND Flash
- – 104MHz Standard/Dual/Quad SPI clocks
- – 208/416MHz equivalent Dual/Quad SPI
- – 50MB/S continuous data transfer rate
- – Fast Program/Erase performance
- – More than 100,000 erase/program cycles
- – More than 10-year data retention
- Efficient “Continuous Read Mode”(1)
- – Alternative method to the Buffer Read Mode
- – No need to issue “Page Data Read” between
- Read commands
- – Allows direct read access to the entire array
- Flexible “Concurrent Operations”
- – Independent single die access
- – Allows “Read while Program/Erase”
- – Allows “Multi Die Program/Erase”
- – Improves Program/Erase throughput
- Low Power, Wide Temperature Range
- – Single 2.7 to 3.6V supply
- – 25mA active, 20µA standby current
- – -40°C to +85°C operating range
- Flexible Architecture with 128KB blocks
- – Uniform 128K-Byte Block Erase
- – Flexible page data load methods
- Advanced Features
- – On chip 1-Bit ECC for memory array
- – ECC status bits indicate ECC results
- – bad block management and LUT(2) access
- – Software and Hardware Write-Protect
- – Power Supply Lock-Down and OTP protection
- – 2KB Unique ID and 2KB parameter pages
- – Ten 2KB OTP pages(3)
- Space Efficient Packaging
- – 8-pad WSON 8x6-mm
- – 24-ball TFBGA 8x6-mm
- – Contact Winbond for other package options
Specifiche
Part Life Cycle Code | Obsolete | Reach Compliance Code | compliant |
ECCN Code | EAR99 | HTS Code | 8542.32.00.51 |
Clock Frequency-Max (fCLK) | 104 MHz | JESD-30 Code | R-PDSO-N8 |
Length | 8 mm | Memory Density | 2147483648 bit |
Memory IC Type | FLASH | Memory Width | 2 |
Number of Functions | 1 | Number of Terminals | 8 |
Number of Words | 1073741824 words | Number of Words Code | 1000000000 |
Operating Mode | SYNCHRONOUS | Operating Temperature-Max | 85 °C |
Operating Temperature-Min | -40 °C | Organization | 1GX2 |
Parallel/Serial | SERIAL | Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Programming Voltage | 3 V | Seated Height-Max | 0.8 mm |
Supply Voltage-Max (Vsup) | 3.6 V | Supply Voltage-Min (Vsup) | 2.7 V |
Supply Voltage-Nom (Vsup) | 3 V | Surface Mount | YES |
Technology | CMOS | Temperature Grade | INDUSTRIAL |
Terminal Form | NO LEAD | Terminal Pitch | 1.27 mm |
Terminal Position | DUAL | Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Type | SLC NAND TYPE | Width | 6 mm |
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Prodotto 365 giorni
Qualità garantita
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In Stock: 5.370
Minimum Order: 1
Qtà. | Prezzo unitario | Est. Prezzo |
---|---|---|
1+ | $5,011 | $5,01 |
200+ | $1,940 | $388,00 |
500+ | $1,872 | $936,00 |
1000+ | $1,838 | $1.838,00 |
I prezzi sottostanti sono solo di riferimento.
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