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Vedi Specifiche Tecniche

MT29F2G08ABDHC:D +BOM

High-speed data transfer and efficient power management enable seamless integration into various applications including enterprise storage systems

Produttore:

Micron Technology
ProduttorePart #:

MT29F2G08ABDHC:D
Scheda dati:

MT29F2G08ABDHC:D Scheda dati (PDF)
ECCN (US):

EAR99
Automotive:

No
PPAP:

No
Cell Type:

SLC NAND
EDA/CAD Modelli:

Richiedi modelli CAD gratuiti per MT29F2G08ABDHC:D

Caratteristiche principali

Open NAND Flash Interface (ONFI) 2.2-compliant1
Multiple-level cell (MLC) technology
Organization
– Page size x8: 8640 bytes (8192 + 448 bytes)
– Block size: 256 pages (2048K + 112K bytes)
– Plane size: 2 planes x 2048 blocks per plane
– Device size: 64Gb: 4096 blocks;
128Gb: 8192 blocks;
256Gb: 16,384 blocks;
512Gb: 32,786 blocks
Synchronous I/O performance
– Up to synchronous timing mode 5
– Clock rate: 10ns (DDR)
– Read/write throughput per pin: 200 MT/s
Asynchronous I/O performance
– Up to asynchronous timing mode 5
tRC/tWC: 20ns (MIN)
Array performance
– Read page: 50µs (MAX)
– Program page: 1300µs (TYP)
– Erase block: 3ms (TYP)
Operating Voltage Range
– VCC: 2.7–3.6V
– VCCQ: 1.7–1.95V, 2.7–3.6V
Command set: ONFI NAND Flash Protocol
Advanced Command Set
– Program cache
– Read cache sequential
– Read cache random
– One-time programmable (OTP) mode
– Multi-plane commands
– Multi-LUN operations
– Read unique ID
– Copyback
First block (block address 00h) is valid when shipped
from factory. For minimum required ECC, see
Error Management (page 109).
RESET (FFh) required as first command after power
Operation status byte provides software method for
detecting
– Operation completion
– Pass/fail condition
– Write-protect status
Data strobe (DQS) signals provide a hardware method
for synchronizing data DQ in the synchronous
interface
Copyback operations supported within the plane
from which data is read
Quality and reliability
– Data retention: 10 years
– Endurance: 5000 PROGRAM/ERASE cycles
Operating temperature:
– Commercial: 0°C to +70°C
– Industrial (IT): –40ºC to +85ºC
Package
– 52-pad LGA
– 48-pin TSOP
– 100-ball BGA

Specifiche

ECCN (US)	EAR99	Part Status	Obsolete
Automotive	No	PPAP	No
Cell Type	SLC NAND	Chip Density (bit)	2G
Architecture	Sectored	Boot Block	No
Block Organization	Symmetrical	Address Bus Width (bit)	18
Sector Size	128Kbyte x 2048	Page Size	2Kbyte
Number of Bits/Word (bit)	8	Number of Words	256M
Programmability	Yes	Timing Type	Synchronous
Max. Access Time (ns)	30	Maximum Erase Time (S)	0.003/Block
Maximum Programming Time (ms)	0.6/Page	Interface Type	Serial-SPI
Minimum Operating Supply Voltage (V)	1.65	Typical Operating Supply Voltage (V)	1.8
Maximum Operating Supply Voltage (V)	1.95	Programming Voltage (V)	1.65 to 1.95
Operating Current (mA)	20	Program Current (mA)	20
Minimum Operating Temperature (°C)	0	Maximum Operating Temperature (°C)	70
Supplier Temperature Grade	Commercial	Command Compatible	No
ECC Support	No	Support of Page Mode	No
Packaging	Tray	Mounting	Surface Mount
PCB changed	63	Pin Count	63
Lead Shape	Ball

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