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MT29F2G01ABAGDWB-IT:G TR +BOM

FLASH - NAND Memory IC 2Gbit SPI 8-UPDFN (8x6) (MLP8)

MT29F2G01ABAGDWB-IT:G TR Descrizione generale

Utilizing NAND technology, this flash memory chip delivers lightning-fast read and write speeds, making it effortless to store and access large volumes of data. Its compact design ensures compatibility with space-restricted devices without compromising on performance or reliability

MT29F2G01ABAGDWB-IT:G TR

Caratteristiche principali

  • Open NAND Flash Interface (ONFI) 2.2-compliant1
  • Multiple-level cell (MLC) technology
  • Organization
  • – Page size x8: 8640 bytes (8192 + 448 bytes)
  • – Block size: 256 pages (2048K + 112K bytes)
  • – Plane size: 2 planes x 2048 blocks per plane
  • – Device size: 64Gb: 4096 blocks;
  • 128Gb: 8192 blocks;
  • 256Gb: 16,384 blocks;
  • 512Gb: 32,786 blocks
  • Synchronous I/O performance
  • – Up to synchronous timing mode 5
  • – Clock rate: 10ns (DDR)
  • – Read/write throughput per pin: 200 MT/s
  • Asynchronous I/O performance
  • – Up to asynchronous timing mode 5
  • tRC/tWC: 20ns (MIN)
  • Array performance
  • – Read page: 50µs (MAX)
  • – Program page: 1300µs (TYP)
  • – Erase block: 3ms (TYP)
  • Operating Voltage Range
  • – VCC: 2.7–3.6V
  • – VCCQ: 1.7–1.95V, 2.7–3.6V
  • Command set: ONFI NAND Flash Protocol
  • Advanced Command Set
  • – Program cache
  • – Read cache sequential
  • – Read cache random
  • – One-time programmable (OTP) mode
  • – Multi-plane commands
  • – Multi-LUN operations
  • – Read unique ID
  • – Copyback
  • First block (block address 00h) is valid when shipped
  • from factory. For minimum required ECC, see
  • Error Management (page 109).
  • RESET (FFh) required as first command after power
  • Operation status byte provides software method for
  • detecting
  • – Operation completion
  • – Pass/fail condition
  • – Write-protect status
  • Data strobe (DQS) signals provide a hardware method
  • for synchronizing data DQ in the synchronous
  • interface
  • Copyback operations supported within the plane
  • from which data is read
  • Quality and reliability
  • – Data retention: 10 years
  • – Endurance: 5000 PROGRAM/ERASE cycles
  • Operating temperature:
  • – Commercial: 0°C to +70°C
  • – Industrial (IT): –40ºC to +85ºC
  • Package
  • – 52-pad LGA
  • – 48-pin TSOP
  • – 100-ball BGA

Specifiche

Programmabe Not Verified Memory Type Non-Volatile
Memory Format FLASH Technology FLASH - NAND
Memory Size 2Gbit Memory Organization 2G x 1
Memory Interface SPI Voltage - Supply 2.7V ~ 3.6V
Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount
Base Product Number MT29F2G01

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