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Vedi Specifiche Tecniche

MT29F2G01AAAEDH4-IT:E +BOM

Flash, 2GX1, PBGA63, 9 X 11 MM, 1 MM HEIGHT, ROHS COMPLIANT, VFBGA-63

Produttore:

Micron Technology Inc.
ProduttorePart #:

MT29F2G01AAAEDH4-IT:E
Scheda dati:

MT29F2G01AAAEDH4-IT:E Scheda dati (PDF)
Part Life Cycle Code:

Obsolete
Reach Compliance Code:

compliant
ECCN Code:

EAR99
HTS Code:

8542.32.00.51
EDA/CAD Modelli:

Richiedi modelli CAD gratuiti per MT29F2G01AAAEDH4-IT:E

MT29F2G01AAAEDH4-IT:E Descrizione generale

FLASH - NAND Memory IC 2Gbit SPI 63-VFBGA (9x11)

Caratteristiche principali

Open NAND Flash Interface (ONFI) 2.2-compliant1
Multiple-level cell (MLC) technology
Organization
– Page size x8: 8640 bytes (8192 + 448 bytes)
– Block size: 256 pages (2048K + 112K bytes)
– Plane size: 2 planes x 2048 blocks per plane
– Device size: 64Gb: 4096 blocks;
128Gb: 8192 blocks;
256Gb: 16,384 blocks;
512Gb: 32,786 blocks
Synchronous I/O performance
– Up to synchronous timing mode 5
– Clock rate: 10ns (DDR)
– Read/write throughput per pin: 200 MT/s
Asynchronous I/O performance
– Up to asynchronous timing mode 5
tRC/tWC: 20ns (MIN)
Array performance
– Read page: 50µs (MAX)
– Program page: 1300µs (TYP)
– Erase block: 3ms (TYP)
Operating Voltage Range
– VCC: 2.7–3.6V
– VCCQ: 1.7–1.95V, 2.7–3.6V
Command set: ONFI NAND Flash Protocol
Advanced Command Set
– Program cache
– Read cache sequential
– Read cache random
– One-time programmable (OTP) mode
– Multi-plane commands
– Multi-LUN operations
– Read unique ID
– Copyback
First block (block address 00h) is valid when shipped
from factory. For minimum required ECC, see
Error Management (page 109).
RESET (FFh) required as first command after power
Operation status byte provides software method for
detecting
– Operation completion
– Pass/fail condition
– Write-protect status
Data strobe (DQS) signals provide a hardware method
for synchronizing data DQ in the synchronous
interface
Copyback operations supported within the plane
from which data is read
Quality and reliability
– Data retention: 10 years
– Endurance: 5000 PROGRAM/ERASE cycles
Operating temperature:
– Commercial: 0°C to +70°C
– Industrial (IT): –40ºC to +85ºC
Package
– 52-pad LGA
– 48-pin TSOP
– 100-ball BGA

Specifiche

Part Life Cycle Code	Obsolete	Reach Compliance Code	compliant
ECCN Code	EAR99	HTS Code	8542.32.00.51
Clock Frequency-Max (fCLK)	50 MHz	JESD-30 Code	R-PBGA-B63
JESD-609 Code	e1	Length	11 mm
Memory Density	2147483648 bit	Memory IC Type	FLASH
Memory Width	1	Number of Functions	1
Number of Terminals	63	Number of Words	2147483648 words
Number of Words Code	2000000000	Operating Mode	SYNCHRONOUS
Operating Temperature-Max	85 °C	Operating Temperature-Min	-40 °C
Organization	2GX1	Parallel/Serial	SERIAL
Programming Voltage	2.7 V	Seated Height-Max	1 mm
Supply Voltage-Max (Vsup)	3.6 V	Supply Voltage-Min (Vsup)	2.7 V
Supply Voltage-Nom (Vsup)	3.3 V	Surface Mount	YES
Technology	CMOS	Temperature Grade	INDUSTRIAL
Terminal Finish	TIN SILVER COPPER	Terminal Form	BALL
Terminal Pitch	0.8 mm	Terminal Position	BOTTOM
Type	SLC NAND TYPE	Width	9 mm
Programmabe	Not Verified	Memory Type	Non-Volatile
Memory Format	FLASH	Memory Size	2Gbit
Memory Organization	2G x 1	Memory Interface	SPI
Voltage - Supply	2.7V ~ 3.6V	Operating Temperature	-40°C ~ 85°C (TA)
Mounting Type	Surface Mount	Base Product Number	MT29F2G01

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