Questo sito web utilizza i cookie. Utilizzando questo sito, acconsenti all'utilizzo dei cookie. Per ulteriori informazioni, dai un'occhiata al nostro politica sulla riservatezza.

MF1S7001XDUF/V1V +BOM

Compact, high-capacity memory device ideal for various industrial and commercial uses

MF1S7001XDUF/V1V Descrizione generale

NXP? has developed the MIFARE? MF1ICS50 to be used in a contactless smart card according to ISO/IEC 14443 Type-A.The MIFARE MF1ICS50 IC is used in applications like public transport ticketing where major cities have adopted MIFARE as their e-ticketing solution of choice.An intelligent anti-collision function allows operating more than one card in the field simultaneously. The anti-collision algorithm selects each card individually and ensures that the execution of a transaction with a selected card is performed correctly without data corruption resulting from other cards in the field.The MF1ICS50 is designed for simple integration and user convenience. Which could allow complete ticketing transactions to be handled in less than 100 ms. Thus, the MF1ICS50 card user is not forced to stop at the reader leading to high throughput at gates and reduced boarding times onto buses. The MIFARE product-based card may also remain in the wallet during the transaction, even if there are coins in it.

NXP Semiconductor inventario

Caratteristiche principali

  • MIFARE, RF Interface (ISO/IEC 14443 A)
  • Contactless transmission of data and supply energy (no battery needed)
  • Operating distance: Up to 100mm (depending on antenna geometry)
  • Operating frequency: 13.56 MHz
  • Data transfer: 106 kbit/s
  • Data integrity: 16-Bit CRC, parity, bit coding, bit counting
  • Anti-collision
  • Typical ticketing transaction: < 100 ms (including backup management)
  • EEPROM
  • 1 kB - 4 kB, organized in 16 sectors with 4 blocks of 16 bytes each (one block consists of 16 bytes)
  • User-definable access conditions for each memory block
  • Data retention of 10 years
  • Write endurance 100.000 - 200.000 cycles
  • Security
  • Mutual three-pass authentication (ISO/IEC DIS 9798-2)
  • An individual set of two keys per sector (per application) to support multiapplication with key hierarchy
  • A unique serial number for each device
  • Delivery options
  • Die on wafer
  • Bumped die on wafer
  • MOA4 or MOA2 contactless card module
NXP Semiconductor Stock originale

Applicazione

  • Industrial
  • Smart City
  • Smart Home
NXP Semiconductor inventario

Specifiche

Category RF and WirelessRFID, RF Access, Monitoring ICs Series -
Type RFID Transponder Frequency 13.56MHz
Standards ISO 14443 Interface UART
Voltage - Supply - Operating Temperature -25°C ~ 70°C
Mounting Type Surface Mount Base Product Number MF1S7001
MF1S70YYX_V1_BD

Politiche di servizio e altro

Relativi al servizio post-vendita e alla liquidazione

payment Pagamento

Metodo di pagamento

hsbc
TT/bonifico bancario
paypal
PayPal
wu
Western Union
mg
Grammo dei soldi

Per canali di pagamento alternativi, contattaci a:

[email protected]
spedizione Spedizione e imballaggio

metodo di spedizione

fedex
Fedex
ups
UPS
dhl
DHL
tnt
NTN
Imballaggio

AVAQ determina e confeziona tutti i dispositivi in base ai requisiti di protezione contro le scariche elettrostatiche (ESD) e il livello di sensibilità all'umidità (MSL)..

Garanzia Garanzia

Promettiamo di fornire un servizio di garanzia della qualità di 365 giorni per tutti i nostri prodotti.

Recensioni

You need to log in to reply. Registrazione | Iscrizione

MF1S7001XDUF/V1V Scheda dati PDF

Preliminary Specification MF1S7001XDUF/V1V PDF Scaricamento

MF1S7001XDUF/V1V PDF Anteprima

In Stock: 7.052

Minimum Order: 1

Qtà. Prezzo unitario Est. Prezzo
1+ $2,289 $2,29
200+ $0,886 $177,20
500+ $0,855 $427,50
1000+ $0,839 $839,00

I prezzi sottostanti sono solo di riferimento.