Questo sito web utilizza i cookie. Utilizzando questo sito, acconsenti all'utilizzo dei cookie. Per ulteriori informazioni, dai un'occhiata al nostro politica sulla riservatezza.

Le immagini servono solo come riferimento,

Vedi Specifiche Tecniche

H27U1G8F2CTR-BC +BOM

High-performance NAND Flash memory chip for data storage and processin

Produttore:

SKHYNIX
ProduttorePart #:

H27U1G8F2CTR-BC
Scheda dati:

H27U1G8F2CTR-BC Scheda dati (PDF)
Pacchetto/custodia:

TSOP48
EDA/CAD Modelli:

Richiedi modelli CAD gratuiti per H27U1G8F2CTR-BC

E-mail: [email protected]

Skype: live:.cid.ab6b29428937b76

tel: +852 95804164

H27U1G8F2CTR-BC Descrizione generale

SK Hynix has developed the state-of-the-art H27U1G8F2CTR-BC NAND flash memory chip to address the increasing demand for high-capacity storage solutions in today's electronic devices. With its storage capacity of 1Gbit (128MB) and 25nm process technology, this chip is well-suited for use in smartphones, tablets, and embedded systems. Its support for both asynchronous and toggle DDR interface, along with a supply voltage range of 2.7V to 3.6V, ensures compatibility with a variety of devices. The chip also offers impressive read speeds of up to 50MB/s and sequential write speeds of up to 20MB/s, making it a reliable choice for applications requiring fast data transfer. Its page size of 2KB and block size of 128KB provide ample storage space, with 2048 blocks available for data storage. Additionally, the H27U1G8F2CTR-BC features a quick program time of 200µs per page and an erase time of 2ms per block, further enhancing its performance efficiency. Whether used in solid-state drives or other embedded systems, the H27U1G8F2CTR-BC offers superior storage capabilities and reliable performance

Caratteristiche principali

High-speed data transfer ensured
Low power consumption guaranteed
Fast read and write capabilities
Reliable storage for demanding applications
Synchronous data transfer supported
Robust design for extreme temperatures

Applicazione

Embedded systems
Automotive
Industrial

Specifiche

Product Category

IC Chips

Politiche di servizio e altro

Relativi al servizio post-vendita e alla liquidazione

Pagamento

Metodo di pagamento

TT/bonifico bancario

PayPal

Western Union

Grammo dei soldi

Per canali di pagamento alternativi, contattaci a:

[email protected]

Spedizione e imballaggio

metodo di spedizione

Fedex

UPS

DHL

NTN

Imballaggio

AVAQ determina e confeziona tutti i dispositivi in base ai requisiti di protezione contro le scariche elettrostatiche (ESD) e il livello di sensibilità all'umidità (MSL)..