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BGM113A256V2 +BOM

This ROHS-compliant SMD-36P RF transceiver IC, known as BGM113A256V2, is designed for reliable wireless communication applications

Description

The BGM113A256V2 is a highly integrated RF transceiver IC from Silicon Laboratories, designed for Bluetooth Low Energy (BLE) applications. It features 256 KB flash memory, 32 KB RAM, and an ARM Cortex-M4 CPU. The device supports dual-mode BLE and has low energy consumption. This IC is suitable for various IoT applications such as wireless sensor networks, home automation, industrial monitoring, healthcare devices, smart city infrastructure, asset tracking, environmental monitoring, smart agriculture, and wearable devices. The BGM113A256V2 offers secure boot and update capabilities, making it a reliable choice for developers. Its integrated BLE radio and multiple peripheral interfaces make it an attractive option for designers seeking to create compact, low-power devices with advanced wireless functionality.

Features

The BGM113A256V2 features:

  • 256 KB flash memory
  • 32 KB RAM
  • Bluetooth 4.2 qualified dual-mode stack
  • Integrated ARM Cortex-M4 CPU
  • Low energy consumption
  • Integrated Bluetooth low energy radio
  • Support for multiple peripheral interfaces
  • Secure boot and secure update capabilities

These features make it suitable for various applications such as wireless sensor networks, home and building automation, industrial monitoring and control, healthcare devices, smart city infrastructure, asset tracking, environmental monitoring, smart agriculture, and wearable devices.

Package

According to the product information, the package type of BGM113A256V2 is SMD-36P.

Pinout

According to the product information, the package type for BGM113A256V2 is SMD-36P. This suggests that the pin count for this IC is likely 36 pins.

As for the function of each pin, it's not explicitly stated in the provided information. However, as a general rule, most RF transceiver ICs like the BGM113A256V2 typically have pins dedicated to various functions such as:

  • Power supply (VCC, GND)
  • Digital I/O (e.g., UART, SPI, I2C)
  • Analog interfaces (e.g., ADC, DAC)
  • Radio frequency (RF) signals (e.g., TX, RX, antenna connections)
  • Clock and reset signals

To determine the exact function of each pin for the BGM113A256V2, you would need to consult the IC's datasheet or other official documentation from Silicon Laboratories.

Manufacturer

The manufacturer of the BGM113A256V2 is Silicon Laboratories, Inc. It's a fabless semiconductor company that designs, develops, and manufactures mixed-signal products, including microcontrollers, wireless modules, and sensors. The company focuses on providing solutions for the Internet of Things (IoT), industrial, and consumer markets. With its strong presence in the IoT space, Silicon Laboratories is well-positioned to help customers develop innovative applications that leverage advanced connectivity, sensing, and processing capabilities.

Applications

Based on the product information, the application areas of BGM113A256V2 are: Wireless sensor networks Home and building automation Industrial monitoring and control Healthcare devices Smart city infrastructure Asset tracking Environmental monitoring Smart agriculture Wearable devices Internet of Things (IoT) applications

Equivalent

Based on the features and specifications, some equivalent products to BGM113A256V2 could be:

  • Nordic nRF52832
  • Texas Instruments CC2652
  • STMicroelectronics STM32WLE5
  • Microchip PIC32C254A

These devices share similar characteristics such as Bluetooth 4.2 support, ARM Cortex-M4 CPU, and low power consumption, making them suitable alternatives for various IoT applications.

BGM113A256V2

Specifiche

Part Life Cycle Code Active Reach Compliance Code compliant
HTS Code 8542.39.00.01 Date Of Intro 2016-03-25
JESD-30 Code R-XXMA-N36 Length 15.73 mm
Number of Functions 1 Number of Terminals 36
Operating Temperature-Max 85 °C Operating Temperature-Min -40 °C
Seated Height-Max 2 mm Supply Voltage-Nom 3.3 V
Surface Mount YES Telecom IC Type TELECOM CIRCUIT
Temperature Grade INDUSTRIAL Terminal Form NO LEAD
Terminal Pitch 0.8 mm Terminal Position UNSPECIFIED
Width 9.15 mm Package/Case 36-SMD Module

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