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BD82HM55 SLGZS +BOM

The BD82HM55 SLGZS is a chipset developed by Intel

BD82HM55 SLGZS Descrizione generale

BD82HM55 SLGZS is a chipset designed by Intel primarily for use in laptops and mobile computing devices. It belongs to the Intel 5 Series chipset family and is specifically targeted towards the mobile platform. The chipset supports Intel Core processors based on the Nehalem microarchitecture and supports various features such as integrated graphics, PCI Express, USB, and SATA interfaces. It also includes support for Intel Turbo Boost Technology, which dynamically adjusts the processor's clock speed to optimize performance.The BD82HM55 SLGZS chipset provides efficient power management features to enhance battery life in portable devices. It offers a balance between performance and power consumption, making it suitable for a range of mobile computing applications. Additionally, it supports Intel Hyper-Threading Technology for improved multitasking capabilities.

Intel inventario

Caratteristiche principali

  • Supports 1st generation Intel Core processors
  • Integrated Graphics Processor
  • Supports dual-channel DDR3 memory
  • Supports Intel Turbo Boost Technology
  • Supports Intel Hyper-Threading Technology
  • Supports Intel Virtualization Technology
  • Supports Gigabit Ethernet
  • Supports Intel Active Management Technology
Intel Stock originale

Applicazione

  • Mobile computing
  • Embedded systems
  • Industrial automation
  • Gaming consoles
  • Media players
  • Information kiosks
  • Medical equipment
  • Networking devices
  • Digital signage
  • Robotics
Intel inventario

Specifiche

Product Category Chipsets Series HM55
Product Mobile Chipsets Type PCH
Code Name Ibex Peak Mounting Style SMD/SMT
Chipset Series HM55 Embedded Options Embedded
Integrated Graphics With Graphics CPU Configuration - Max 1
Graphics Output CRT, DisplayPort, DVI, eDP, HDMI, LVDS, SDVO Length 27 mm
Maximum Operating Temperature + 108 C Moisture Sensitive Yes
Number of Displays Supported 2 Number of SATA Ports 4
Number of USB Ports 14 PCIe Configurations 6 Lanes
PCIe Revision Revision 2.0 Product Type Chipsets
Factory Pack Quantity 450 Subcategory Chipsets
TDP - Max 3.5 W USB Revision Revision 2.0
Width 25 mm Part # Aliases 904127
Unit Weight 0.572232 oz

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