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A3PE3000-PQG208 +BOM

This FPGA features 3M gates and operates at a frequency of 231MHz

A3PE3000-PQG208 Descrizione generale

With a 208-pin QFP package, the A3PE3000-PQG208 FPGA is a compact yet capable solution for a variety of applications. Operating at a core voltage of 1.2V and supporting multiple I/O voltage options, this FPGA offers flexibility for different voltage requirements. Its clock management options, including PLLs and DLLs, further enhance its adaptability to various clocking schemes, making it suitable for a wide range of applications in the field of digital electronics

Caratteristiche principali

High Capacity

600 k to 3 Million System Gates

108 to 504 kbits of True Dual-Port SRAM

Up to 620 User I/Os

Reprogrammable Flash Technology

130-nm, 7-Layer Metal (6 Copper), Flash-Based CMOS Process

Instant On Level 0 Support

Single-Chip Solution

Retains Programmed Design when Powered Off

On-Chip User Nonvolatile Memory

1 kbit of FlashROM with Synchronous Interfacing

High Performance

350 MHz System Performance

3.3 V, 66 MHz 64-Bit PCI

In-System Programming (ISP) and Security

ISP Using On-Chip 128-Bit Advanced Encryption Standard (AES) Decryption via JTAG (IEEE 1532compliant)

FlashLock Designed to Secure FPGA Contents

Low Power

Core Voltage for Low Power

Support for 1.5-V-Only Systems

Low-Impedance Flash Switches

High-Performance Routing Hierarchy

Segmented, Hierarchical Routing and Clock Structure

Ultra-Fast Local and Long-Line Network

Enhanced High-Speed, Very-Long-Line Network

High-Performance, Low-Skew Global Network

Architecture Supports Ultra-High Utilization

Pro (Professional) I/O

700 Mbps DDR, LVDS-Capable I/Os

1.5 V, 1.8 V, 2.5 V, and 3.3 V Mixed-Voltage Operation

Bank-Selectable I/O Voltagesup to 8 Banks per Chip

Single-Ended I/O Standards: LVTTL, LVCMOS 3.3 V / 2.5 V / 1.8 V / 1.5 V, 3.3 V PCI / 3.3 V PCI-X, and LVCMOS 2.5 V / 5.0 V Input

Differential I/O Standards: LVPECL, LVDS, B-LVDS, and M-LVDS

Voltage-Referenced I/O Standards: GTL+ 2.5 V / 3.3 V, GTL 2.5 V / 3.3 V, HSTL Class I and II, SSTL2 Class I and II, SSTL3 Class I and II

I/O Registers on Input, Output, and Enable Paths

Hot-Swappable and Cold Sparing I/Os

Programmable Output Slew Rate and Drive Strength

Programmable Input Delay

Schmitt Trigger Option on Single-Ended Inputs

Weak Pull-Up/-Down

IEEE 1149.1 (JTAG) Boundary Scan Test

Pin-Compatible Packages across the ProASIC3E Family

Clock Conditioning Circuit (CCC) and PLL

Six CCC Blocks, Each with an Integrated PLL

Configurable Phase-Shift, Multiply/Divide, Delay Capabilities and External Feedback

Wide Input Frequency Range (1.5 MHz to 350 MHz)

SRAMs and FIFOs

Variable-Aspect-Ratio 4,608-Bit RAM Blocks (1, 2, 4, 9, and 18 organizations available)

True Dual-Port SRAM (except 18)

24 SRAM and FIFO Configurations with Synchronous Operation up to 350 MHz

ARM Processor Support in ProASIC3E FPGAs

M1 ProASIC3E DevicesCortex-M1 Soft Processor Available with or without Debug

Specifiche

Part Life Cycle Code Active Reach Compliance Code compliant
HTS Code 8542.39.00.01 Factory Lead Time 52 Weeks
Clock Frequency-Max 350 MHz JESD-30 Code S-PQFP-G208
JESD-609 Code e3 Length 28 mm
Moisture Sensitivity Level 3 Number of CLBs 75264
Number of Equivalent Gates 3000000 Number of Inputs 147
Number of Logic Cells 75264 Number of Outputs 147
Number of Terminals 208 Operating Temperature-Max 70 °C
Operating Temperature-Min Organization 75264 CLBS, 3000000 GATES
Peak Reflow Temperature (Cel) 245 Power Supplies 1.5/3.3 V
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY Qualification Status Not Qualified
Seated Height-Max 4.1 mm Supply Voltage-Max 1.575 V
Supply Voltage-Min 1.425 V Supply Voltage-Nom 1.5 V
Surface Mount YES Technology CMOS
Temperature Grade COMMERCIAL Terminal Finish MATTE TIN
Terminal Form GULL WING Terminal Pitch 0.5 mm
Terminal Position QUAD Time@Peak Reflow Temperature-Max (s) 30
Width 28 mm

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